Description
BP10 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites. Performance on metal surfaces should be thoroughly tested in the individual application. BP10 has a good degree of cure even at lower ambient temperatures. To achieve full mechanical properties and thermal resistance, post-curing of at least 3h 60°C is recommended. However, good mechanical properties are already developed after initial curing of 24h RT.
